Maƙallin injin tsotsa mai ramuka na SiC mai kauri don sarrafa Wafer mai lanƙwasa da siriri

Na'urar wanke-wanke ta ƙarfe ta St.Cera ta haɗa wani layin yumbu mai ramuka mai silikon carbide (SiC) tare da tushen ƙarfe mai daidaitacce (aluminum ko bakin ƙarfe). Kayan SiC mai ramuka mai ramuka (shuɗi-baƙi, porosity 35-40%, girman rami 20-30 μm, permeability 60 ml/cm²·min) yana ba da rarraba injin tsabtace iri ɗaya, mai laushi a duk faɗin saman wafer, yana kawar da alamar gefen kuma yana ba da damar tallafawa mara taɓawa ga siririn wafer (≤100 μm) ko wafers masu lanƙwasa. Layer ɗin SiC yana ba da ƙarancin faɗaɗa zafi (3.5×10⁻⁶/℃), kwanciyar hankali na zafi har zuwa 1000°C, da matsakaicin ƙarfin lanƙwasa (32-35 MPa). Tushen ƙarfe yana ƙara tauri na tsari, sauƙin hawa ta hanyar ramukan zare, da kariya daga karyewar karyewa. Wannan na'urar ta dace da niƙa a baya, yankewa, da sarrafa wafer mai zafi mai yawa inda injin tsabtace iri ɗaya da dacewar zafi suke da mahimmanci.

Bayani dalla-dalla (bisa ga bayanan SiC mai ramuka da aka bayar):

Lura: Ƙarfin lanƙwasa ya yi ƙasa da SiC mai yawa saboda porosity. Sifofin tushe na ƙarfe ba daga teburan yumbu ba ne.

Aikace-aikace:

• · Niƙa ƙananan wafers a bayan baya (≤100 μm)
• · Haɗa wafer mai lanƙwasa don yanka
• · Yin amfani da wafer mai zafi sosai (har zuwa 1000°C)
• · Gyaran injin tsotsa don ramuka masu ramuka ko masu rauni

Masana'antu:

Farantin SiC mai ramuka (wanda aka yi da ramuka masu ramuka, an yi masa sintiri) → an lanƙwasa shi zuwa lanƙwasa ≤10 μm → An ƙera tushen ƙarfe tare da tashoshin injina da fasalulluka na hawa → haɗin epoxy ko mannewa na inji → gwajin zubar da helium.

Sarrafa Inganci:

• · An tabbatar da girman ramuka da ramuka ta hanyar SEM
• · Gwajin dawwama (guduwar iska)
• · An auna faɗin da aka yi amfani da na'urar auna haske ta laser
• · Yawan zubar da Helium <1×10⁻⁹ Pa·m³/s

Fa'idodi akan Grooved ko Dense Ceramic Chucks:

• · Babu alamar wafer - injin tsabtace iri ɗaya ba tare da ramuka daban-daban ba
• · Tsaftace kai da kai - rage toshewar pores
• · Yana riƙe da wafers masu lanƙwasa (har zuwa 500 μm baka)
• · Tushen ƙarfe yana hana karyewar karyewa kuma yana sauƙaƙa haɗakarwa

Iyakoki:

• · Ƙarfin lanƙwasawa (32–35 MPa) – guje wa ɗaukar nauyin tasiri
• · Zafin aiki da aka iyakance zuwa 1000°C (SiC mai ramuka), amma haɗin ƙarfe na epoxy yana iyakance zuwa ≤200°C sai dai idan an manne shi ta hanyar injiniya
• · Ba don injin injin mai matsin lamba mai yawa ba (tsarin ramuka yana iyakance matsakaicin bambancin injin)

Keɓancewa:

• · Tushen ƙarfe: aluminum (mai sauƙi), bakin ƙarfe (mai jure lalata), Invar (ƙarancin faɗaɗawa)
• · Haɗawa: epoxy (≤200°C) ko manne na inji (har zuwa 500°C)
• · Zoben rufewa na gefen don sarrafa injin tsabtace yanki

Lura: Ƙarfin lanƙwasa da aka bayar (32–35 MPa) ya yi ƙasa sosai da yumbu mai yawa saboda ramuka. A yi amfani da shi da kyau don guje wa tsagewar gefen.