Fim ɗin Tallafawa na Yumbu don Kayan Aikin Semiconductor
Ana amfani da fil ɗin tallafi na yumbu na St.Cera (wanda kuma aka sani da fil ɗin ɗagawa ko fil ɗin tallafi) a cikin ɗakunan aikin semiconductor don ɗaga wafers ko substrates yayin sarrafawa, dumama, ko sanyaya. An ƙera su daga 99.8% alumina ko silicon nitride, waɗannan fil ɗin suna ba da ƙarfi mai ƙarfi na matsi, kwanciyar hankali na zafi, da juriya ga sinadarai. Tsarin ƙarshen hemispherical ko lebur yana hana karce wafer.
Bayani dalla-dalla(Alumina 99.8%):
| Kadara | darajar |
| Kayan Aiki | 99.8% Al₂O₃ ko Si₃N₄ |
| Tsawon | 10 – 100 mm |
| diamita | 1 – 10 mm |
| Siffar Tip | Lebur, mai faɗi, mai siffar hemisphere |
| Ƙarfin Matsi (Al₂O₃) | >2000 MPa |
| Matsakaicin Zafin Aiki (Al₂O₃) | 1600°C |
| Ƙarshen Fuskar | An yi lanƙwasa (Ra ≤0.4 μm) |
| Juriya akan Diamita | ±0.01 mm |
Aikace-aikace:
Filayen ɗagawa a cikin ɗakunan CVD/PVD
Tallafin fil don yin burodin hotplate
Tsarin tallafin katin bincike
Tallafin jirgin ruwan tanda na Quartz
Masana'antu:
Niƙa mai daidaici ba tare da tsakiya ba na OD → niƙa lu'u-lu'u na bayanin martaba na tip → tsaftacewar ultrasonic → Duba girma 100%.
Sarrafa Inganci:
CMM don tsayi/diamita, mai kwatanta haske don radius na tip, gwajin kaya don tabbatar da ƙarfin matsi (samfurin bazuwar kowane yanki). Babu gurɓataccen ferromagnetic (an tabbatar da shi da maganadisu).
Fa'idodi akan Metal ko Quartz Pins:
Tsawon rayuwa sau 5 fiye da bakin karfe
Babu gurɓatar ƙarfe a cikin ɗakin aiki
Ƙarfin zafin da ya fi ƙarfin quartz (1600°C vs 1100°C)
saman da ba ya mannewa (rage mannewar barbashi)
Keɓancewa:
Bayanan martaba da yawa na tip, tushen zare, ko shaft mai kauri.
Muna kuma samar da fil ɗin SiC don yanayin da ke cikin plasma mai tsanani.
