Farantin Niƙa na Alumina Mai Tsabta Mai Kyau don Daidaita Lapping
St.Cera'sfarantin niƙa na yumbuAn ƙera shi daga alumina mai tsafta mai ƙarfi 99.8% (Al₂O₃) don yin amfani da shi daidai gwargwado da niƙa. Ƙarfin niƙa namu daidai yana cimma daidaiton 0.003mm, daidaitawa na 0.002mm, da kuma kammala saman Ra0.1, yana tabbatar da cire kayan aiki iri ɗaya a duk saman farantin. Farantin yana ba da juriya mai kyau ga lalacewa (Vickers 16 GPa), ƙarfin lanƙwasa mai ƙarfi (361 MPa), da kwanciyar hankali na zafi har zuwa 800°C. Akwai shi a cikin tsari mai zagaye har zuwa diamita 600mm da faranti masu kusurwa huɗu har zuwa tsawon 1500mm. Ana samun saman lanƙwasa (faɗin tsagi 0.5–2.0mm) don rarraba slurry a cikin tsarin lapping. Ana duba kowane farantin da laser interferometer kuma ana ba shi rahoton auna daidaito.
Bayani dalla-dalla (bisa ga 99.8% Al₂O₃& Ƙarfin masana'antu na St.Cera):
| Kadara | darajar |
| Kayan Aiki | 99.8% Alumina (Ivory) |
| Yawan yawa | 3.93 g/cm³ |
| Ƙarfin Lankwasawa | 361 MPa |
| Taurin Vickers | 16 GPA |
| Diamita na waje (max) | 600mm |
| Tsawon (matsakaicin) | 1500mm |
| Kauri (max) | 100mm |
| Faɗi | 0.003mm |
| Daidaito tsakanin mutane | 0.002mm |
| Ƙarshen Fuskar | Ra0.1 |
| Matsakaicin Yanayin Aiki | 800°C |
Aikace-aikace:
- · Latsa abubuwan da aka yi da yumbu da hatimin ƙarfe
- · Niƙa bayan baya na wafers na semiconductor
- · Goge abubuwan gani
- · Babban tsari mai lanƙwasa substrate
Daidaito Ƙarfin:
- · Daidaito: 0.005mm
- · Daidaito: 0.005mm
- · Zagaye: 0.002mm
