Bernoulli Ceramic Effect Effect — Kula da Wafer mara taɓawa don Wafers masu siriri da rauni

Na'urar St.Cera's Bernoulli ceramic end effector tana amfani da iskar gas don sarrafa wafers ba tare da taɓawa ta jiki ba. An ƙera ta daga alumina mai tsarki 99.8% (Al₂O₃) ko silicon carbide (SiC), tana da bututun ƙarfe masu inganci waɗanda ke fitar da iskar gas mai matsi don ƙirƙirar fim ɗin iska mai siriri tsakanin na'urar ƙarewa da wafer. Wannan ƙa'idar da ba ta taɓawa ba tana kawar da gurɓataccen gefen baya, guntuwar gefen, da lalacewar saman, wanda hakan ya sa ya dace da wafers masu siriri (≤100 μm), masu rauni, ko masu lanƙwasa. Na'urar yumbu tana ba da ƙarfin lanƙwasa mai yawa (361 MPa don Al₂O₃; har zuwa 550–600 MPa don SiC), ƙarancin nauyi, da kwanciyar hankali mai kyau, yana tabbatar da matsayi mai maimaitawa a cikin robots masu canja wurin wafer mai sauri.

Bayani akan Kayan Aiki:Alumina (Al₂O₃) ita ce kayan da aka fi amfani da su wajen sarrafa ƙarshen yumbu a cikin na'urar sarrafa wafer ta semiconductor saboda kyakkyawan haɗinsa na tauri, rufin lantarki, kwanciyar hankali na sinadarai, da kuma inganci mai kyau. Silicon carbide (SiC) yana ba da mafi girman juriyar zafi, mafi girman tauri, har ma da mafi kyawun juriya ga lalacewa don aikace-aikacen da suka fi buƙata. Duk da cewa yttria-stabilized zirconia (ZrO₂) yana ba da ƙarfin karyewa mai yawa a zafin ɗaki, ba a cika amfani da shi ba a cikin wannan aikace-aikacen saboda yawansa da halayen faɗaɗa zafi daban-daban; ana iya la'akari da shi don takamaiman yanayi inda ake buƙatar ƙarfin karyewa na musamman. Da fatan za a tuntuɓi ƙungiyar fasaha don jagorar zaɓin kayan.

Bayani dalla-dalla(bisa ga 99.8% Al₂O₃):

Ka'idar Aiki:

Iska mai matsewa ko nitrogen (0.2–0.6 MPa) ana samar da ita ta hanyoyin ciki da kuma fita ta hanyar bututun da suka dace. Iskar iska mai sauri tana haifar da yankin matsin lamba mai ƙarancin ƙarfi sama da mai tasirin ƙarshe (tasirin Bernoulli), wanda ke samar da ƙarfin ɗagawa wanda ke tallafawa wafer a tazara ta 50–200 μm. Babu ramuka ko kushin da ke taɓa bayan wafer.

Aikace-aikace:

• · Siraran wafer (≤50 μm) da ake sarrafawa bayan niƙa a bayan gida
• · Jigilar wafer mai karkacewa (misali, bayan CVD ko annealing)
• · Canja wurin hasken rana da kuma hasken LED sapphire substrate
• · Aiki da kai na ɗakin tsaftacewa wanda ba ya buƙatar samar da ƙwayoyin cuta ba
• · Gudanar da panel ɗin gilashi a masana'antar nuni

Tsarin Masana'antu:

An yi amfani da sinadarin yumbu mai kauri daga foda mai tsafta → Injin CNC mai axis 5 na tashoshin iskar gas da ramukan bututun ƙarfe (diamita 0.3–1.0 mm, haƙuri ±0.01 mm) → Lapping saman zuwa Ra ≤0.4 μm → tsaftacewar ultrasonic → gwajin zubar helium (tashoshin gas). Ba a buƙatar rufewa ba - saman yumbu mara komai yana da sinadarai kuma ba ya gurɓatawa.

Sarrafa Inganci:

• · Duba girman 100% (CMM) na matsayin bututun ƙarfe, tsawon hannu, da kuma lanƙwasa
• · Gwajin daidaiton kwararar iska: raguwar matsin lamba ≤5% a duk bututun ƙarfe
• · Gwajin zubewa: tashoshin iskar gas da aka rufe a 0.6 MPa, babu raguwar matsin lamba sama da daƙiƙa 30
• · Duba gani a ƙarƙashin na'urar microscope 20× don gano ƙananan fasa ko ƙuraje

Afa'idodi fiye da Masu Ingantaccen Hulɗa na Gargajiya:

• · Gurɓatar bayan gida ba tare da wafer ba — babu hulɗa ta inji
• · Babu fashewar gefen ko fashewar siririn wafers
• · Yana riƙe da wafers masu lanƙwasa (har zuwa 1 mm baka) tare da gibin da ya dace
• · Yana kawar da injin samar da injin tsotsa da kuma kula da bututun da ke da ramuka
• · Gine-ginen yumbu yana tsayayya da lalacewa da harin sinadarai

Keɓancewa:

• · Akwai don girman wafer na 200 mm, 300 mm, ko na musamman
• · Tsarin bututun iskar gas: nau'ikan bututun ƙarfe madaidaiciya, mai kusurwa, ko vortex
• · Kayan aiki: alumina (daidaitacce) ko silicon carbide (don mafi girman ƙarfin lantarki da juriya ga lalacewa)
• · Tsawon hannu, flange mai hawa, da wurin tashar iskar gas a kowane zane na OEM

Iyakoki:

Aiwatar da ƙa'idar Bernoulli (ƙirƙirar bututun ƙarfe, gibin iska) ya wuce iyakokin teburin kayan da aka bayar. Sifofin injina da na zafi da ke sama suna bin takaddun bayanai da aka bayar don 99.8% Al₂O₃. Ba a tsammanin lalacewar aiki na yumbu a ƙarƙashin kwararar iskar gas mai matsin lamba bisa ga waɗannan sifofin kayan ba. Ga wafers masu saurin kamuwa da kwararar iskar gas (misali, MEMS masu sassauƙa), ya kamata a daidaita matsin lamba na iskar gas da ƙirar bututun ƙarfe daidai gwargwado.