Alumina-Tushen Porous yumbu injin tsotsa don Thin Wafer Handling
An ƙera bututun mai ramuka na St.Cera daga Al₂O₃ mai ƙarfi 99.6% tare da buɗaɗɗen rami mai sarrafawa na 30-45% da girman rami ɗaya wanda ya kama daga 10 zuwa 50 μm. Ba kamar bututun mai ramuka ba, saman mai ramuka yana ba da injin tsabtace iska mai rarrabawa a duk bayan wafer ɗin, yana kawar da alamar gefen kuma yana ba da damar riƙewa mai laushi na siririn (≤100 μm) ko wafers masu lanƙwasa. Kayan yana ba da ƙarfin lanƙwasa ≥250 MPa da kwanciyar hankali na zafi har zuwa 400°C a cikin iska.
Bayani dalla-dalla(bisa ga 99.6% Al₂O₃):
| Kadara | darajar |
| Kayan Aiki | 99.6% Alumina (Fari) |
| Porosity | 30–45% (wanda za a iya daidaitawa) |
| Matsakaicin Girman Rami | 10–50 μm |
| Ƙarfin Lankwasawa | ≥250 MPa |
| Yawan yawa | 3.88 g/cm³ |
| Faɗi (fiye da 200mm) | ≤5 μm |
| Matsakaicin Yanayin Aiki | 400°C (iska) |
| Ƙarshen Fuskar | An yi lanƙwasa (Ra ≤0.8 μm) |
Aikace-aikace:
- · Siraran wafer (≤50 μm) niƙa a bayan gida
- · Haɗa wafer mai lanƙwasa don yanka
- · Ɗauki na musamman
- · Gudanar da gilashin da aka yi da gilashi
Masana'antu:
Foda da aka haɗa da fom ɗin ramuka → matsewa mai isostatic → sintering a 1600°C → lapping zuwa kauri na ƙarshe. Ana gwada kowane chuck don daidaiton injin (ɓangaren matsin lamba <5%) kuma ana duba shi don rarraba girman ramuka (SEM).
Abũbuwan amfãni akan chucks na al'ada:
- · Babu alamar bayan wafer ko canjin die
- · Yana riƙe wafers masu baka har zuwa 500 μm
- · Tsarin tsaftace kai (rafuka suna hana toshewar ramuka)
- · Tallafin da aka yi da kayan aiki yana kawar da damuwa a cikin gida
Cdaidaitawa:
Siffofi masu zagaye ko murabba'i, diamita 100-450 mm. Zoben rufe gefuna yana samuwa don sarrafa injin tsabtace wuri mai tsari.
Nemi samfurin da ya dace da girman wafer ɗinka.
