Bututun injin yumbu mai ramuka don sarrafa Wafer mai lanƙwasa
An ƙera bututun yumbu mai ramuka na St.Cera daga alumina mai tsabta mai girman 30-45% kuma girman ramukan ya kama daga 10 zuwa 100 μm. Ba kamar bututun da aka yi da ramuka na gargajiya ba, saman ramukan yana samar da injin tsabtace iska mai rarrabawa a duk bayan wafer ɗin, yana riƙe da wafers masu karkace, siriri, ko waɗanda aka haɗa ba tare da ɗagawa ko karyewa ba. Injin tsabtace iska mai laushi (wanda za'a iya daidaitawa ta hanyar mai hanawa) kuma yana hana alamar bayan.
Bayani dalla-dalla(bisa ga 99.6% Al₂O₃):
| Kadara | darajar |
| Porosity | Kashi 30–45% |
| Matsakaicin Girman Rami | 10–100 μm (wanda za a iya zaɓa) |
| Ƙarfin Lankwasawa | ≥250 MPa |
| Faɗi (fiye da 300mm) | ≤5 μm |
| Ƙarshen Fuskar | An yi lanƙwasa (Ra 0.8 μm) |
| Matsakaicin Matakin Injin Tsafta | -80 kPa |
| Yanayin Aiki | 400°C (iska), 600°C (mara aiki) |
| Kayan Aiki | 99.6% Al₂O₃, ZrO₂, ko SiC |
Aikace-aikace:
Niƙa bayan gida mai sirara (≤50 μm)
Haɗa wafer mai lanƙwasa don yanka
An ɗauko single die daga tef ɗin
Gudanar da panel ɗin gilashi
Masana'antu da Inganci:
Foda mai yumbu da aka haɗa da foda mai ruɓi na halitta → an matse → an lanƙwasa shi zuwa kauri na ƙarshe. Ana gwada kowane chuck don daidaiton injin (≤5% karkacewa) kuma ana duba shi don rarraba girman ramuka (SEM). An auna faɗinsa da na'urar aunawa ta laser.
Abũbuwan amfãni akan Grooved Chucks:
Babu alamar gefen wafer ko canjin mutu
Yana riƙe wafers masu lanƙwasa (har zuwa 500 μm baka)
Yana kawar da toshewar ramin injin
Tallafin kai-tsaye ga ƙananan substrates
Keɓancewa:
Siffofi masu zagaye ko murabba'i, girmansu har zuwa mm 600. Za mu iya amfani da zoben rufewa na gefe ko sassan injin tsabtace yanki. Siffofin da aka yi da ƙarfe suna samuwa don buƙatun tauri mai yawa.
Nemi samfurin girman wafer ɗinku da gwajin warpage ɗinku.
